Chipbond Guangfu FAB 46.23kWp
Organization name :
Chipbond Technology Corporation.
Energy :
solar
Address :
No. 12, Guangfu Rd., Hukou Township, Hsinchu County
Device Capacity :
46.23 kW
Certificate No. :
22SP0019-B024000001~40
T-REC Lastest Issued Date :
2025-02-20
Period :
2023-12-28~2024-12-31
Equipment Verified Report :
Verified
Generation Verified Report :
Verified