Chipbond Guangfu FAB 46.23kWp
Organization name :
Chipbond Technology Corporation.
Energy :
solar
Address :
No. 12, Guangfu Rd., Hukou Township, Hsinchu County
Device Capacity :
46.23 kW
Certificate No. :
22SP0019-B026000001~17
T-REC Lastest Issued Date :
2026-07-20
Period :
2026-01-01~2026-05-31
Equipment Verified Report :
Verified
Generation Verified Report :
Verified